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September 13, 2021

How to Build a Better Chiplet Packaging to Extend Moore’s Law

Kandou’s CEO, Dr. Amin Shokrollahi, talks chiplets in a piece by John Blyler. Full story available on DesignNews.com at: https://www.designnews.com/electronics/how-build-better-chiplet-packaging-extend-moores-law .

Solving the AI memory and interconnect wall

Kandou’s CEO, Dr. Amin Shokrollahi, talks chiplets in a piece by John Blyler.

Full story available on DesignNews.com at: https://www.designnews.com/electronics/how-build-better-chiplet-packaging-extend-moores-law.

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Solving the AI memory and interconnect wall