Revolutionizing wired connectivity is a complicated job, and we need dedicated, visionary professionals to make it happen. Kandou AI’s collaborative, diverse culture is tailormade to give you the support, guidance and rewards you’re looking for, and the day-to-day challenges that come with going beyond in one of the fastest changing and most exciting areas of tech engineering.
We offer our employees a hybrid working model with flexible working hours to help provide a better work-life balance. As part of our team you will benefit from a management style that provides you with the autonomy to develop, along with the support you need to grow. You will work in a dynamic, multicultural environment with experts who are passionate about chip technology and its potential to make a difference in a connected world.
We are hiring a Package Design Engineer to drive advanced IC package development across our UK, Switzerland, or Taiwan sites. You will lead package design, collaborate with IC layout and assembly partners, verify electrical performance, and ensure cost-efficient, high-quality BGA and LF substrates. Strong experience with Cadence APD/SIP, packaging technologies, simulation tools, and parasitic extraction is required.
We are hiring an Analog Design Engineer to join our world-class team. You will work on the design, modeling, and verification of custom analog circuits for high-speed SerDes transceivers in advanced technology nodes.
We are hiring a Signal Integrity Lead Engineer to join our world-class team. You will drive SI/PI design and analysis across silicon, packaging, and system levels for next-generation high-speed connectivity products.
Gareth, Product Engineering Manager
UK
Yosra, R&D Digital Design Engineer
Switzerland
