Why Kandou?
Revolutionizing wired connectivity is a complicated job, and we need dedicated, visionary professionals to make it happen. Kandou AI’s collaborative, diverse culture is tailormade to give you the support, guidance and rewards you’re looking for, and the day-to-day challenges that come with going beyond in one of the fastest changing and most exciting areas of tech engineering.
Working at Kandou
We offer our employees a hybrid working model with flexible working hours to help provide a better work-life balance. As part of our team you will benefit from a management style that provides you with the autonomy to develop, along with the support you need to grow. You will work in a dynamic, multicultural environment with experts who are passionate about chip technology and its potential to make a difference in a connected world.

Working with
experts
Challenged
every day
Hybrid &
flexible working
Open knowledge
sharing
Latest Vacancies
Analog Design Engineer UK (Reading) or CH (Lausanne)
We are hiring an Analog Design Engineer to join our world-class team. You will work on the design, modeling, and verification of custom analog circuits for high-speed SerDes transceivers in advanced technology nodes.
Signal Integrity Lead Engineer UK (Reading) or CH (Lausanne)
We are hiring a Signal Integrity Lead Engineer to join our world-class team. You will drive SI/PI design and analysis across silicon, packaging, and system levels for next-generation high-speed connectivity products.
Memory Systems Engineer CH (Lausanne)
We are looking for a Memory Systems Engineer to drive architecture, modeling, and validation of advanced DRAM subsystems for next-generation computing platforms. You will work across simulation, FPGA prototyping, and SoC architecture to optimize performance and guide design decisions.
Analog Layout Engineer (Lead) UK (Reading) or CH (Lausanne)
We are hiring an Analog Layout Lead Engineer to join our world-class team. You will lead the layout and verification of advanced high-speed analog circuits and IP for multi-Gigabit chip-to-chip links, collaborating closely with design and integration teams.
Packaging Engineer Taiwan (Taipei City)
We are looking for a Packaging Engineer to lead advanced assembly and packaging solutions for our next-generation connectivity products. You will own package design, technology selection, and partner management—driving quality, manufacturability, and performance across our silicon supply chain.
What’s it like?
Gareth, Product Engineering Manager
UK

Yosra, R&D Digital Design Engineer
Switzerland
