Before Kandou AI
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We are building breakthrough AI systems with our innovative interconnect technology at their core.
AI models are growing exponentially. Memory footprints are exploding. Agentic systems are multiplying the demand for fast, efficient memory access. But today’s AI infrastructure is working around a fundamental constraint.
With Kandou AI
Kandou's proprietary Copper MIMO (aka Chord Signaling TM) is the copper interconnect technology changing that. It unlocks higher bandwidth, longer reach, and lower power over copper. Enabling a new generation of AI systems where memory and compute connect at scale without forcing everything into ever-denser, more expensive packages.
Our upcoming products solve the four critical bottlenecks limiting AI datacenters, unlocking the next frontier of AI scaling through breakthrough connectivity.
GPU Connectivity
Energy efficient GPU scale-up and scale-out connectivity with 448G and beyond copper links.
Memory Connectivity
Efficient scaling of memory subsystems with groundbreaking chip-to-chip links.
Network Connectivity
Cost-effective networking by extending the reach of copper links vs. traditional PAM based SerDes.
Rack Connectivity
Field Repairable Near Package Optics (NPO) for improved thermal design and reliability.
Our AI products address the critical infrastructure layers that determine AI system performance.
From AI fabrics for inference and CXL memory systems to high-speed copper connectivity for scale-up and scale-out networks, we are building the technologies that move, share, and access data more efficiently across the AI data center.
