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Jan 30, 2025
Kandou's Foundational Technologies
Dec 6, 2024
Kandou contributes to new Electrical Interfaces and Metrics OCP white paper
Oct 10, 2024
Move Beyond SECDED: Meet DIMMGuard
Sep 30, 2024
Accelerate your diagnostics with Besso: PCIe debugging made faster and easier
Aug 29, 2024
PCI-SIG member Rommel Camillo of Kandou discusses how PCIe technology is used in chiplets
Jun 26, 2024
Debugging is about to get a lot faster
Jun 5, 2024
What is a retimer?
May 29, 2024
Kandou talks high-speed interfaces, generative AI, and the rapid pace of change with Micro-Electronics
Apr 29, 2024
How Kandou has been getting ready to unlock AI from day one
Apr 10, 2024
Keeping you cool in a crisis
Mar 18, 2024
Capacity Limitations and Increased AI Demand Fuel a 19% Rise in US Data Centre Prices
Feb 19, 2024
Kandou’s CFO, Jeff Winzeler, will be sharing its Vision and Market-Leading Solutions Strategy at the UBS Annual Spring 2024 Semiconductor Conference
Aug 10, 2017
Kandou Glasswing Silicon Back from Foundry
Sep 20, 2016
Kandou was elected among the top 60 emerging companies to watch by EE Times
Jul 25, 2016
Bessemer Venture Partners Invests $15 Million in Kandou
Jul 11, 2016
Kandou's Glasswing IP JEDEC Compliant
Mar 28, 2016
Kandou Licenses Glasswing SerDes Technology to Marvell
Mar 14, 2016
Kandou's David Stauffer to Speak about ENRZ at OFC Market Watch Session
Mar 16, 2014
The next generation's modulation - PAM-4, NRZ, or ENRZ?
Mar 4, 2014
Kandou Touts Multi-Signal Chords
Feb 25, 2014
OIF Product Showcase at OFC Features Cutting-Edge Products Utilizing OIF Supported Technology
Feb 23, 2014
A brief history of Kandou Bus
Feb 18, 2014
Startup Promises Bandwidth Boost
Feb 10, 2014
Kandou Resolves Today's Chip Interconnect Performance/Power Bottleneck for Mobile and Networking Applications
Aug 29, 2013
More power for mobiles & Co., Success Startup
May 27, 2021
Kandou Unveils First Device in USB-C® Multiprotocol Retimer Product Family for USB4
Mar 25, 2021
Waiting for Chiplet Standards
Mar 24, 2021
Chiplets Gain Popularity, Integration Challenges
Mar 15, 2021
Designing 2.5D Systems
Jan 28, 2021
Retiming USB4 over USB-C®
Nov 17, 2020
Kandou Raises $92.3 million in Series C Funding
Oct 21, 2020
Matterhorn is a Game Changer!
Jul 16, 2020
Kandou Appoints Jeff Winzeler CFO
Jul 9, 2020
Say Hello to Matterhorn
May 12, 2020
Coherent Logix Selects Kandou’s SerDes IP
Apr 15, 2020
Kandou Named One of Europe's Most-Promising Growth Companies
Feb 20, 2020
Three EPFL spin-offs among Europe's top 50 "super scale-ups"
Aug 10, 2017
Kandou Glasswing Silicon Back from Foundry
Sep 20, 2016
Kandou was elected among the top 60 emerging companies to watch by EE Times
Jul 25, 2016
Bessemer Venture Partners Invests $15 Million in Kandou
Jul 11, 2016
Kandou's Glasswing IP JEDEC Compliant
Mar 28, 2016
Kandou Licenses Glasswing SerDes Technology to Marvell
Mar 14, 2016
Kandou's David Stauffer to Speak about ENRZ at OFC Market Watch Session
Mar 16, 2014
The next generation's modulation - PAM-4, NRZ, or ENRZ?
Mar 4, 2014
Kandou Touts Multi-Signal Chords
Feb 25, 2014
OIF Product Showcase at OFC Features Cutting-Edge Products Utilizing OIF Supported Technology
Feb 23, 2014
A brief history of Kandou Bus
Feb 18, 2014
Startup Promises Bandwidth Boost
Feb 10, 2014
Kandou Resolves Today's Chip Interconnect Performance/Power Bottleneck for Mobile and Networking Applications
Aug 29, 2013
More power for mobiles & Co., Success Startup
