September 15, 2017
Ultra Low Latency FEC for Kandou Glasswing SerDes
Very Low Power and Only 1.28ns Latency! Test and characterization of our test silicon for Glasswing is ongoing. As you may recall, Kandou’s Glasswing SerDes is optimized for die-to-die interconnect inside a shared MCM package.
Very Low Power and Only 1.28ns Latency!
Test and characterization of our test silicon for Glasswing is ongoing. As you may recall, Kandou’s Glasswing SerDes is optimized for die-to-die interconnect inside a shared MCM package. Total bandwidth is 500 Gbit/s of bidirectional throughput on 2.4 mm of die edge. Power consumption is 0.82 pJ/bit as measured on our test silicon.
Kandou has also developed an optional, low-latency Forward Error Correction (FEC) block that can be layered on top of the Glasswing hard macro. The FEC block, which is delivered in RTL format, can be used to:
- Increase eye margin, and/or
- Reduce power
This FEC is Kandou’s proprietary design, runs with very low power consumption, and adds just 1.28 ns of latency to Glasswing’s class-leading 4.42 ns link latency. This latency is low enough so as to not interfere with most credit-based or request-grant protocols.
