Santa Clara, CA, USA and Lausanne, Switzerland — August 14^th2026 — Kandou AI, a leader in high-speed, energy-efficient connectivity and system solutions for the AI era, has received the “Demo of the Year” Award at the “Innovate with TSMC!” event during the 2026 TSMC Europe Technology Symposium.

The award recognizes Kandou AI’s demonstration highlighting the transformative impact of its high-speed Chip-to-Chip connectivity technology (Tigerwing^®) for next-generation AI infrastructure.

The demonstration addressed a fundamental constraint in modern AI systems: efficiently moving growing volumes of data among processors, accelerators, memory, and network interfaces without bandwidth, latency, or power consumption becoming performance bottlenecks.

As AI clustersscale, memory and interconnect bandwidth are increasingly becoming key bottlenecks. System efficiency increasingly depends on interconnect architectures that deliver greater bandwidth density while maintaining low energy consumption and low latency. Kandou AI presented its approach to these challenges through advanced signaling and connectivity technologies designed for AI and data-center applications.

“Our goal is to deliver systems that help customers reduce the cost and increase scale of AI infrastructure deployments. With Tigerwing^®, for the first time ever, we can connect chips across the entire PCB with the same efficiency as chiplets on the same package – this is a game changer for AI systems design,” says Srujan Linga, CEO and Co-founder of Kandou AI.

Kandou AI received this award for both its technical breakthrough and the strategic importance of efficient data movement as a first-ordersystem-design consideration for AI systems. As accelerator counts increase, interconnect efficiency has a direct impact on utilization, power consumption and infrastructure economics.

Kandou AI thanks TSMC for this recognition and for their ongoing support in bringing our next generation silicon products to life. The award reinforces Kandou AI’s commitment to building revolutionary AI systems powered by our breakthrough interconnect technology delivering best-in-class performance, scale and efficiency.