At the end of August 2025, we announced a breakthrough in chip connectivity: the successful tape-out of Tigerwing™, our next-generation chip-to-chip interconnect IP, on TSMC’s leading-edge process node.

In just four months from concept to tape-out, our team achieved a milestone that sets new benchmarks for innovation, performance, and speed in semiconductor connectivity.

What Makes Tigerwing™ a Game-Changer?

Tigerwing™ is engineered for high-performance, low-latency, low-power communication between chips—particularly in AI, high-performance computing (HPC), and datacenter platforms. Our new IP delivers die-to-die connectivity on standard PCB form factors, eliminating the need for advanced packaging. This makes board design easier, integration faster, and time-to-market shorter for the most demanding applications.

Key Benefits:

• Chip-to-chip connectivity with Die-to-die performance on standard boards—no advanced packaging required.

• Optimized for AI, HPC, and datacenter deployments, providing robust low-latency, low-power, high-bandwidth links.

Accelerating Innovation Together

“This tape-out demonstrates our team’s ability to push the boundaries of interconnect technology while maintaining speed, reliability, and energy efficiency,” said Thomas Boudrot, VP of Sales and Business Development. Tigerwing™ empowers architects and engineers to rethink how they build high-speed, scalable computing solutions—especially where advanced packaging was once required.