Our mission is to democratize AI infrastructure. Delivering AI systems that are dramatically more scalable, efficient, and affordable, enabling a future where AI is accessible to everyone.

Srujan is the CEO and Co-Founder of Kandou AI. Prior to joining Kandou AI, Srujan served as the Senior Investment and Financial Structuring Director for the CHIPS for America Program at the U.S. Department of Commerce (approximately $53bn program to strengthen semiconductor manufacturing and advanced R&D in the US). In addition to his CHIPS responsibilities, Srujan served as a core member of the AI taskforce within the Department of Commerce focused on strengthening US leadership in AI infrastructure.

Previously, Srujan was a Managing Director and Global Head of Structured Credit Financing Group at Goldman Sachs (GS). During his tenure at GS, he built and scaled several successful businesses across Investment Banking and Capital Markets. He spearheaded creation of several innovative, first-of-their-kind financing programs for clients such as Wireless Spectrum backed financing for Telecom companies and Loyalty Programs backed financing for Airlines. Earlier in his career, Srujan led development of innovative computer algorithms for equities trading and built successful electronic derivatives trading businesses in Japan, Korea and India.

He graduated with a Masters Degree in Electrical Engineering and Computer Science specializing in Robotics and Machine Learning from MIT, Cambridge, USA and Bachelor’s degree in Electronics and Communication Engineering from Indian Institute of Technology (IIT), Guwahati, India where he graduated top of his class. Srujan is a CFA charter holder.

Prior to joining the financial industry, Srujan conducted cutting edge research in wireless communications and biomedical imaging. He is the author of several technology research publications on new MIMO coding techniques for wireless communications and phase contrast tomography for soft-tissue imaging.

As CEO of Kandou AI, Srujan is based in the United States.

Amin is the Chief Technology Officer and Co-Founder of Kandou AI and is one of Switzerland’s most inspiring entrepreneurs.

Kandou AI is a leading provider of high-speed, energy-efficient chip-to-chip link solutions to improve the way the world connects and communicates.

Amin has been at the forefront of research in information communication for the last 20 years. He was Chief Scientist of Digital Fountain (now Qualcomm), a company specializing in the transmission of data on unreliable networks and inventor of Raptor codes, a class of codes standardized by 3GPP, DVB, IPTV and other standards bodies. An IEEE Fellow, he has published more than 200 papers in peer-reviewed journals and has more than 200 granted and filed patents in information transmission.

Taher Madraswala is the Chief Operating Officer of Kandou AI, bringing more than three decades of semiconductor leadership experience across silicon engineering, operations, and global scale-up. He oversees Kandou AI’s engineering and operations, leading execution of the company’s product roadmap from silicon development through customer delivery.

Prior to joining Kandou AI, Taher was Vice President at Quest Global, where he served as Strategic Client Partner for a leading Japanese semiconductor company and delivered long-term engineering agreements. Previously, he was Vice President and General Manager at Intel, managing a Custom Silicon business across automotive, graphics, and specialized silicon programs.

Earlier in his career, Taher served as President and CEO of Open-Silicon, where he led the company’s turnaround to a successful acquisition. He began his career at Intel, HAL Computer Systems, and HCL.

Taher holds an Executive MBA from IIM Bangalore, an MS in Computer Engineering, and a BS in Electrical Engineering, all with honors.

As Chief Operating Officer of Kandou AI, Taher is based in the United States.

Subhash leads Strategy at Kandou AI. Prior to joining Kandou AI, he helped launch new product categories including Mobile Application Acceleration at Kwicr, and Packet over Glass (APM).

He had many senior executive roles at multiple start-ups and public companies including Kwicr, AMCC, Cape Semiconductor, Kodiak Venture Partners, and TranSwitchCorp, and has served as either a board member or adviser for multiple private venture-backed companies.

Subhash has 33 granted and pending patent applications.

Anant heads Engineering and has overall responsibility for conceptualization, design, development and productization of Kandou AI’s products and silicon IP.

This includes sub functions like architecture, IC design, software development, validation and characterization, EDA tools and lab infrastructure.

He was Product Design Manager at Innovative Silicon S.A., responsible for the development and deployment of Z-RAM® based memory IP for both the embedded and DRAM markets. The technology was licensed by AMD and Hynix Semiconductor, and the company was acquired by Micron Technologies in 2010.

Anant started his career at Intel Corporation in 1998, where as Senior Member of Technical Staff he was instrumental in productization of Low Voltage Swing technology on Pentium® 4. He has designed caches and custom high-speed ALU components on various generations of Intel Pentium® III and Core processors.

Jay has extensive experience in architecting and shipping server and data storage systems for data centers. At Kandou AI, he uses this background to identify key problems to apply our technology to, and to develop product architectures for these problems.

Prior to joining Kandou AI, he was VP Technology at Hyve Solutions where he partnered with leading CPU, GPU, memory and storage device companies to develop systems for large hyperscalers. Previous to that, he led the server hardware engineering teams at eBay and Twitter to develop TCO optimized infrastructure for their internal clouds and key workloads. He started his server design career at Sun Microsystems designing multi-GPU server blades and has worked at silicon and startup companies developing storage and network processors.

Jay received his Ph. D. from Purdue University and his M. Tech. and B. Tech. degrees from the Indian Institute of Technology, Bombay all in EE. He has over 20 granted and applied patents and over 15 publications.

As head of Human Resources, Karen is responsible for the development of Kandou AI’s global HR strategy and organizational development through people, technology and compliance.

Karen brings to Kandou AI more than 20 years of professional HR experience, building strong relationships and developing exceptional careers across the semiconductor industry.

Before joining Kandou AI, Karen was HR Director, UK & Ireland, for the global, semiconductor design and manufacturing company Texas Instruments Limited (TI). Whilst at TI, Karen was instrumental in shaping the long-term direction of this multi-billion-dollar, international organization by adapting HR strategy, policies, procedures and the organizational development to a constantly changing environment.

Karen is a Chartered Fellow of the CIPD and joined Kandou AI in 2017.

Robert leads Kandou AI’s intellectual property group and is responsible for curating and enforcing all aspects of Kandou AI’s IP.

After completing his MSEE and working as an engineer in Motorola’s Corporate Research labs, Robert received a JD from Northwestern University and began his legal career at the Chicago law firm of Niro Scavone Haller & Niro.

He was also an equity partner at patent boutique MBHB in Chicago where he specialized in patent prosecution and patent litigation, prior to starting up a new in-house patent prosecution team at InterDigital Communications in the Philadelphia area.

Armin Tajalli has been with Kandou AI since 2011, as part of the initiating team of the company. Prior to that, he worked as a post-doctoral fellow with Professor Amin Shokrollahi at EPFL, Lausanne, Switzerland.

An IEEE Senior Member, Armin has published over 120 papers in peer-reviewed journals and conferences and holds more than 40 granted and pending patens. He currently serves on the Technical Program Committees of the IEEE Custom Integrated Circuits (CICC), and the IEEE European Solid-State Circuits (ESSERC), IEEE Design Automation and Test in Europe (DATE), and an Associated Editor for the IEEE Transaction on VLSI Systems.

Sridhar Lakshminarayana is Senior Vice President of Business Development and Sales at Kandou AI, where he leads the company’s global commercial strategy and customer engagement across hyperscalers and the broader AI infrastructure ecosystem.

With over 30 years of experience in the semiconductor industry, Sridhar has a proven track record of scaling complex connectivity technologies from early design wins to high-volume deployment, bridging engineering innovation with real-world adoption across hyperscale, networking, consumer, IoT, and telecom markets.

Prior to Kandou AI, Sridhar served as VP of Worldwide Sales at Alphawave Semi-Qualcomm Inc. , where he led connectivity DSP engagements with leading hyperscalers and ecosystem partners, focusing on high-speed optical and electrical interconnect for scale-up and scale-out architectures.

Earlier in his career, he held leadership roles across sales, product marketing, and field applications at Broadcom, Semtech, and PMC-Sierra (now part of Microchip).

Sridhar holds an M.S. in Electrical Engineering from Arizona State University.