Powering the future of AI Infrastructure
At the intersection of information theory and semiconductor design.
We discovered how to harness the interference and noise inherent in copper channels as information.
Transforming what was once considered a limitation into the very mechanism that unlocks copper's full potential.
Input Signal
Clean digital data enters the link.
Ouput Signal
Crosstalk interference and other noise severely degrade output signal.
Interference is turned into an asset and its energy harnessed to boost signal.
Input Signal
Ouput Signal
Clean data enters the link. However, crosstalk interference and other noise severely degrade output signal.
Clean data enters the link and the interference is turned into an asset and its energy harnessed to boost signal.
Copper MIMO
(Chord SignalingTM)
Revolutionary interconnect technology that unlocks the full potential of copper links
Today, we’re using our interconnect technology to reimagine how memory, compute and rack-scale connectivity work together for AI systems
Redefining the Economics of AI.
Over 10X lower cost.
3X lower power.
8X more scale.
Possibilities. Supercharged.
We are building revolutionary AI systems powered by breakthrough connectivity for AI Inference, CXL memory platforms, and ultra-high-speed scale-up and scale-out networking.
GPU Connectivity
We enable energy efficient GPU scale-up and scale-out connectivity with our next gen 448G and beyond copper links.
Memory Connectivity
We enable efficient scaling of memory subsystems for processors with our groundbreaking chip-to-chip links.
Network Connectivity
We enable cost-effective networking solutions by extending the reach of copper links compared to conventional PAM based SerDes technologies
Rack Connectivity
Our technology for Field Repairable Near Package Optics (NPO) improve thermal design, increase reliability and significantly reduce repair times for optical components.
Our trusted partners and investors.
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