At the intersection of information theory and semiconductor design.
We discovered how to harness the interference and noise inherent in copper channels as information.
Transforming what was once considered a limitation into the very mechanism that unlocks copper's full potential.
Input Signal
Clean digital data enters the link.
Ouput Signal
Physics of copper turns it into garbled crosstalk.
The noise is harnessed into high-capacity energy.
Input Signal
Ouput Signal
Clean data enters the link. However, the physics of copper turns it into garbled crosstalk.
Clean data enters the link and the noise is harnessed into high-capacity energy.
Copper MIMO
(Chord SignalingTM)
A proprietary technology that eliminates the need for costly High Bandwidth Memory (HBM) chips using the copper already in your system.
Today, we're reimaginging how memory, compute, and connectivity work together for the next generation of AI systems.
Redefining the Economics of AI.
Over 10X lower cost.
3X lower power.
8X more scale.
Possibilities. Supercharged.
Building revolutionary AI systems powered by breakthrough connectivity for AI Inference, CXL memory platfroms, and ultra-high-speed scale-up, scale-across and scale-out networking.
GPU Connectivity
We enable energy efficient GPU scale-up and scale-out connectivity with our next gen 448G and beyond copper links.
Memory Connectivity
We enable efficient scaling of memory subsystems for processors with our groundbreaking chip-to-chip links.
Network Connectivity
We enable cost-effective networking solutions by extending the reach of copper links compared to conventional PAM based SerDes technologies
Rack Connectivity
Our technology for Field Repairable Near Package Optics (NPO) improve thermal design, increase reliability and significantly reduce repair times for optical components.
Our trusted partners and investors.
